1. Approach to reducing the investment unit

TDK Corporation (“the Company”) recognizes that reducing the investment unit is one effective means of improving the liquidity of shares and expanding the investor base.

2. Policy on reducing the investment unit

To obtain a fair valuation of the Company’s shares in the stock markets, the Company proactively discloses information and conducts other investor relations activities targeting shareholders and other investors. As a result, the Company believes that its share liquidity is sufficient at this time. The Company will consider a smaller investment unit carefully, taking stock market trends and trends in the Company’s stock price, among other factors, into consideration.

MALVERN, Pa. — July 30, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified thick film power resistor featuring a clip mount TO247 package for direct mounting on a heatsink. For automotive applications, the Vishay Sfernice LTO 150 offers industry-high power dissipation of 150 W at a +45 °C case temperature and an improved pulse handling capability.

 

The device released today provides up to 70 % higher power dissipation than competing devices in the TO247 package. This reduces the need for components to cool the resistor — saving board space, simplifying layouts, and reducing overall solution costs. These benefits are amplified by the LTO 150’s 30 % improvement in energy handling compared to similar TO247 devices, which allows designers to utilize fewer resistors.

 

Offering high temperature operation to +175 °C and a broad range of resistance values from 0.03 Ω to 1.3 MΩ, the LTO 150 serves as the precharge or discharge resistor for inverters, converters, and on-board chargers for electric vehicles (EV), hybrid electric vehicles (HEV), and plugged hybrid electric vehicles (PHEV). It can also be used in general industrial and military power conversion applications. The RoHS-compliant device offers a non-inductive design, tolerances down to ± 1 %, and superior reliability tests results (i.e. extensive temperature cycling from 1000 cycles and up).

 

Samples and production quantities of the new resistor are available now, with lead times of 8 to 12 weeks. 

 

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. 

 

ROHM today announced the availability of a new sensor shield (expansion board) equipped with 8 sensor boards (e.g. accelerometer, barometric pressure, geomagnetic, heart rate sensors, etc.) designed for use with existing open platform MCU boards such as Arduino, and mbed.

 

The SensorShield-EVK-003 is the latest sensor evaluation kit offered by ROHM. The updated kit bundles 8 individual sensor boards produced by the ROHM Group (including a new optical heart rate sensor) along with a shield board for connecting to open platforms, making it easy to configure a sensor environment by simply incorporating software and connecting to Arduino Uno or other popular MCU board. This enables immediate verification of sensor operation and facilitates the design of sensor devices, significantly reducing development load while promoting the expansion of the IoT market.

 

In addition to meeting user demands for a kit (SensorShield-EVK-003), the sensor shield and sensor evaluation boards are available for purchase separately through online distributors. Additionally, all documents and materials necessary for operating the sensor kit can be downloaded from our website.

 

In recent years, following the proliferation of IoT in infrastructure, agriculture, automotive, and other areas, many companies have emerged, offering services, applications, and devices to meet the needs of the IoT market. However, significant development effort along with hardware and software expertise is required when creating products for the expanding IoT ecosystem. Additionally, the development and mounting environment for each IoT device will inherently differ, preventing easy evaluation.